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Description
WL 0.1mm BGA reballing stencils kit for iPhone Baseband NAND A8-A16 upper lower CPU soldering repair, BGA reballing stencil template come with black positioning mold, WL high quality soldering BGA reballing stencil with fixed plate,
WL high accuracy solder Jig template ball solder stainless steel net for iPhone Baseband NAND chip, A8 A9 A10 A11 A12 A13 A14 A15 A16 CPU BGA reballing stencils template.
WL 0.1mm BGA Reballing Stencils Kit with Black Positioning Mold For iPhone A8 A9 A10 A11 A12 A13 A14 A15 A16 CPU Baseband NAND Soldering Repair Tool
[ Optional Types ] :
- Option 1: A8 CPU Upper
- Option 2: A8 CPU Lower
- Option 3: A9 CPU Upper
- Option 4: A9 CPU Lower
- Option 5: A10 CPU Upper
- Option 6: A10 CPU Lower
- Option 7: A11 Upper layer+lower layer
- Option 8: A12 Upper layer+lower layer
- Option 9: A13 Upper +lower
- Option 10: A14 Hard disk+baseband
- Option 11: A14 CPU Positioning version
There are 3 sections of parts, BGA Reballing Stencil + Mold Positioning (Black) + Aluminum Universal Mold Base (Gold)
with fixed plate ( black positioning mold ), easy to use and more accurate CPU IC welding position
[ Optional aluminum mold base ] : It is universal, can fit with any black positioning mold
[ Optional Positioning Mold (Black) ] : Not universal, cannot work with different BGA Reballing Stencil, you need the right BGA Reballing Stencil model, the black positioning mold only match the right BGA Reballing Stencil.
