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Description
WL 0.1mm BGA Reballing Stencil Template For iPhone Baseband / NAND / A8-A16 CPU Upper / Lower
[ Option BGA Reballing Stencil Package ] :
Suggest Choose: BGA Reballing Stencil + Black Positioning Mold
(Choose different package ), and just 1pcs Aluminum Mold Base, easy for your working, and also save money
- Option 1: iPhone 5/5S Baseband and NAND
- Option 2: iPhone 6/6P Baseband and NAND
- Option 3: iPhone 6S/6SP Baseband and NAND
- Option 4: iPhone 7/7P Baseband and NAND
- Option 5: iPhone 8/8P/X Baseband and NAND
- Option 6: iPhone XS MAX XR Baseband and NAND
- Option 7: A6 CPU upper -- out of stock
- Option 8: A7 CPU Upper
- Option 9: A6 / A7 CPU Lower
- Option 10: A8 CPU Upper
- Option 11: A8 CPU Lower
- Option 12: A9 CPU Upper
- Option 13: A9 CPU Lower
- Option 14: A10 CPU Upper
- Option 15: A10 CPU Lower
- Option 16: A11 CPU Lower
- Option 17: A12 CPU Lower
[ Optional Aluminum Mould Base ] : it is universal, can fit with any Black Positioning Mold,
- Option 1: Included base
- Option 2: Without base
Optional Positioning Mold (Black): Not univeral, can't working with different BGA Reballing Stencil, need the right model BGA Reballing Stencil, the Black Positioning Mold just match with the right BGA Reballing Stencil.
- Option 1: Included Positioning Mold
- Option 2: Without Positioning Mold
There have 3 parts section, BGA Reballing Stencil + Positioning Mold (Black) + Universal Aluminum Mold Base (Golden)
BGA Reballing Stencil + Black Positioning Mold
Full Set: BGA Reballing Stencil + Positioning Mold (Black) + Universal Aluminum Mold Base (Golden)
0.1 - 0.12mm thickness, high hardness, hardly deformed, increase the success rate on BGA reballing Solder working, it is the top quality BGA Reballing Stencil for iPhone Baseband CPU and NAND, A10 / A9 / A8 CPU..
WL top quality fast speed BGA reballing solder template stencil
Demo video : http://diyfixtoolt.shop/v_show/id_XMTg5MDA1NDkyOA==.html
