Sunshine SS-T12B Intelligent Heating Platform for iPhone 7-16 Pro Max, mobile phone motherboard preheating separation desoldering repair. SS-T12B Multi-functional universal intelligent maintenance heating separator platform supports Android+iPhone series Motherboard Heating groove for iPhone X/11/12/13/14/15/16 Pro Max Android Phone motherboard CPU Face ID repair.
Features:
The Modules Use for:
T12B-IP1: Common for most models of screen bracket separation/fingerprint repair/CPU chip degumming/face repair.
T12B-IP2: Fingerprint repair/A12/A11/X/XS/XSM motherboard delamination.
T12B-IP3: iPhone 11/11P/11PM/A13 motherboard layering.
T12B-IP4: CPU chip degumming/12/12Mini/12P/12PM motherboard layering.
T12B-IP5: iPhone 13/13Mini/13P/13PM/A15 motherboard layering.
T12B-IP6: iPhone 14/14Plus/14P/14PM/A15/A16 motherboard layering.
T12B-IP7: iPhone X/XR/XS/XSM/12P/12PM/13/13Mini camera.
T12B-IP8: iPhone 11/11P/11PM/13P/13PM camera.
T12B-IP9: iPhone 7G/7P/8G/8P/11/12/12Min/14/14Plus/14P/14PM camera.
T12B-IP10: Android universal.
T12B-IP11: for iPhone 15/15 Plus/15 Pro/15 Pro Max/A16/A17 motherboard layering.
T12B-IP12: for iPhone 16/16 Plus/16 Pro/16 Pro Max/A18 motherboard layering.