Relife RL-601T Middle Layer Tin Planting BGA Reballing Platform Set for iPhone X-16 Pro Max motherboard repair. RL-601T BGA reballing metal stencil motherboard middle frame planting tin reballing platform soldering / desoldering / reballing repair tool, Relife iPhone middle layer planting tin soldering fixture.
Features:
1. Middle layer tin planting platform set for iPhone X/XS/XS Max/11/ 11 Pro/11Pro Max/12/12 Mini/12 Pro/12Pro Max/13/13 Mini/13 Pro/13Pro Max/14/14 Plus/14 Pro/14Pro Max/15/15 Plus/15 Pro/15 Pro Max/16/16 Plus/16 Pro/16 Pro Max.
2. High-quality steel, round and square precise hole positions make the solder balls more rounded and prevent the mesh from jamming the solder balls.
3. Super magnetic force / Multi-model infinite extension base / Precise positioning and close fit.
4. Anti-drum, so that each solder ball is round and full, to meet the needs of various chips.
5. Comes with precise positioning, so it is more convenient to align the holes.
i2C Syn14 18-in-1 Universal Silicone Middle Layer Tin Planting Platform for iPhone X to 14Pro Max
Features:
TE-194 18 IN 1 middle layer tin planting station for iPhone X to 14Pro Max .
Features:
the Apple X-16 PM Mid-Layer Soldering Station made with non-heat-absorbing silicon gel material. This equipment is specifically designed for efficient and precise soldering on the mid-layer of the Apple X-16 PM model, ensuring optimal performance and durability.