Qualcomm Qu1234 MSM Series CPU BGA Reballing Stencils Template

Qualcomm Qu1/2/3/4 MSM series BGA reballing stencil templates, universal BGA reballing stencil template MSM8996 MSM7225A MSM8953 MSM8994, multi-purpose QCOM CPU MSM universal BGA soldering stencils kit, PCU BGA reball stencils kit for Huawei Samsung Android mobile phone repair

Qualcomm Multi-purpose QCOM CPU MSM BGA Reballing Stencils Kit Soldering Template For Mobile Phone Reballing Repair Tool

[ Optional Types ] :

• Option 1: QU1 MSM8996 A/B MSM8976 A/B MSM8992 A/B.

MSM8976=MSM8956

• Option 2: QU2 MSM8953 B01/1AB MSM8937 MSM8998 A/B MSM8916

MSM8916=8929/8939/8216/8636/8939
MSM8937=8940/8917

• Option 3: QU3 MSM7225A MSM8928 B MSM8940 MSM8937 SDM660 MSM8909 MSM8928 A MSM8952 MSM8612.

MSM8928=8926/8226/8228/8628/8626/8526
MSM7225A=7227A/7625A/7627A/8225/8255Q/8625/8625Q
MSM8621=8610/8212/8210/8112
MSM8940=8937/8917

• Option 4: QU4 MSM8994 A/B MSM8974 A/B MSM8960 A/B

MSM8974=8274/8674

Product Features :

1. Amaoe Imported Japan for universal phone BGA reballing stencil template
2. 100% new brand and high quality.
3. Super thin thickness, just 0.12mm, easy to use.
4. Special designed: Heat dissipating holes design.
5. High quality steel material, can work great with any universal phone repair BGA rework station.
6. Offer the best BGA Repair solution for phone heating repair.

Product Specifications :

• Item name: BGA Reballing Stencil Template
• 100%: High quality
• Material: Imported Japan steel sheet
• Color: As pictures show
• Type: Amaoe universal BGA reballing template
• Thickness: 0.12mm
• Design: Heat dissipating holes design
• Application: For Android phone BGA reballing soldering repair
• Unit Type: Piece
• Suitable for: for general rework station
• Function: for phone BGA reballing

Package includes :

• 1pcs x BGA Reballing Stencil