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MECHANIC iPhone X-16 Pro Max Mid-Layer Reballing Platform

$36.99 $42.99


Tags:

BGA Reballing Platform BGA Reballing Stencil
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  • Description

Mechanic Middle Layer Tinning Platform with Mid-frame Stencil for iPhone X/11/12/13/14/15/16 Pro Max motherboard repair. A set of tinning kit with a universal magnetic base, different types of positioning plates and steel mesh is used for iPhone X-16 Pro Max middle layer tinning and soldering. It is an essential tool for mobile phone repair shops to repair iPhone.

Features:
1. Expanded universal base unlimited expansion, no need to frequently change the base.
2. Six strong magnetic adsorption, stable without shaking. Built-in six strong magnets ensure that the stencil fits tightly and is not afraid of any shaking.
3.  Bright and full solder joints can ensure that each solder joint falls on the predetermined position accurately. 
4. Tight fit, accurate mesh positioning. High-precision equipment production and processing, the error is close to zero. Improve maintenance efficiency and avoid repeated operation without solder paste in place.
5. The soldering joints are firm and reliable, without any false soldering phenomenon, the unique design of the chip soldering stencils, bright and round solder joints.

Product Parameters:
Name: MECHANIC X-16 Mid-layer Tinning Station Set
Module: Motherboard module x 6, Universal base x1
Stencil: 19 pieces
Packing: 205.7x125.5x30.4mm
Gross Weight: 721G
Use: Support for iPhone X/11/12/13/14/15/16 series motherboard maintenance.