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Description
iFixes i504L iN223 iN559 100g lead-free flux paste BGA Repair Solder Paste for Mobile Phone PCB PGA BGA SMD rework soldering repair. iFixes Lead-free halogen-free solder paste welding paste phone finishing soldering consumables suitable for Circuit Boards nano chips, mobile phone PCB, SMT repair, electronic components, BGA chip ball soldering.
Features:
1. iFixes lead-free halogen-free solder paste 100g large-capacity packaging mobile phone finishing welding consumables series.
2. Good welding ability, no corrosion and no residue, reduce needle test interference and keep the appearance of the weld beautiful.
3. Lead-Free Eco-Friendly: supports high-demand soldering tasks, such as smartphone PCB repairs and BGA chip reballing.
4. The syringe injection dosage is accurate and there is no welding waste.
5. Suitable for nano chips, mobile phone PCB, SMT repair, electronic components, BGA chip ball soldering.
Option:
1. iFixes i504L Yellow BGA Solder Paste 100g.
2. iFixes iN223 BGA Repair Solder Paste 100g.
3. iFixes iN559 BGA Repair Solder Paste 100g.
Product Parameters:
Name: Lead-free halogen-free solder paste.
Net Weight: 100g.
Storage Recommendations: Store in a cool, indoor environment, away from heat sources to maintain product quality.
Note: solder paste can only can be sent out by special mail post.
