IC Chip Thin Blade BGA Glue Remove Knife For iPhone CPU Disassemble

5 in 1 IC Chip Repair Thin Blade CPU NAND Remover BGA Maintenance Knife Remove Glue Disassemble Phone PC Rework Processor Tools.

Features:
1. Professional repair tool set for iPhone CPU disassemble.
2. For BGA repair,dismantling phone CPU chip and phone repair.
3. It can be used to separate the welding spot.