AMAOE PD-C Planting Tin Pad Magnetic CPU BGA Reballing Platform

AMAOE PD-C Planting Tin Pad for iPhone A8-A17 CPU RAM BGA Reballing Platform, iPhone 6-15 Pro MAX CPU IC BGA chips reballing soldering repair, Mobile Phone BGA chip Adsorption Silicon Mat.

Amaoe PD-C Tin Planting Pad high-temperature resistant insulating silicone pad. Amaoe PD-C pad used with a magnetic positioning base and is suitable for tin implantation and welding of chips with a thickness of less than 0.9mm.

Option:
1. Amaoe PD-C Tin Planting Pad only.
2. Amaoe PD-C pad with magnet base set