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Description
3 IN 1 iphone 6-12promax NAND BGA Reballing Stencil Template Mold,WL Hard Disk Baseband Magnetic Plattorm Tinned Steel Mesh NAND BGA Reballing Tin Net Stencils With Position Fixture for Iphone 5/5S 6/6P 6S/6SP 7/7P /8 /8P/ X/XR/XS/XSMAX/11/11PRO /11PRO MAX/11/11PRO /11PRO MAX/12/12PRO /12Mini/12PRO MAX.
[ Optional Types ] :
Option 1: 3 IN 1 WL NAND Hard Disk BGA Reballing Stencil
Option 2: Universal Positioning Mold
Option 3:WL NAND BGA Reballing Stencil With Magnetic Base
Feature：
Quality is very good
Magnetic base + positioning plate + tin mesh ( Together to use )
WL BGA reballing stencils kit come with black positioning mold
WL high accuracy BGA reballing stencils template for iPhone 5S 6 6P 7 8 X XS Max 11PRO MAX 12 series soldering repair
Notice :
Black positioning mold with fixed plate, easy to use and more accurate CPU IC welding position.
The Black Positioning Mold just match with the right BGA Reballing Stencil.
[ Option Aluminum Mold Base ] : it is universal, can fit with any black positioning mold, ( Choose different package ), and just 1pcs aluminum mold base, easy for your working, and also save money
[ Option Positioning Mold - Black ] : Not universal, can't working with different BGA reballing stencil, need the right model BGA reballing stencil, the black positioning mold just match with the right BGA reballing stencil.
