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Description
AMAOE BGA Reballing Stencil EMMC1 EMMC2 EMMC3 steel mesh for Android phone repair. Universal 0.15mm Amaoe EMMC EMCP Font UFS UMCP LPDDR NAND PCIE BGA Reballing Stencil for Android phones repair. Universal BGA Reballing Glue Removal Platform With 56pcs stencils For EMMC, iOS CPU, Font, Qualcomm, Hisilicon, MediaTek CPU series ICs, ect.
Option:
1. EMMC:1 stencil: For Android BGA221 BGA153 BGA169 BGA254 BGA162 BGA186 EMCP EMMC Font. EMMC:1 is discontinued, EMMC:3 is a replacement.
2. EMMC:2 stencil: For Android Hard Disk EMMC EMCP UFS Nand Flash.
3. EMMC:3 stencil: For Android EMMC EMCP UFS UMCP LPDDR NAND PCIE BGA152 BGA153 BGA169 BGA221 BGA186 BGA297 BGA254 BGA178 BGA220 BGA110 BGA60 BGA70.
4. Universal BGA Reballing Glue Removal Platform With 56pcs stencils set.
5. Amaoe Phone EMMC Reballing Platform with BGA153 BGA162 BGA169 BGA186 BGA221 BGA254 0.15mm reballing stencil.
6. Amaoe EMMC/EMCP/UFS Font Reballing Platform with EMMC/EMCP/UFS 0.15mm reballing stencil for Phone Font BGA153 BGA162 BGA221 BGA254 repair.
7. Amaoe TV EMMC CMCP UFS Planting Tin Platform with Mbga-MY3-0.15mm BGA169 BGA153 reballing stencil.
8. Amaoe TV EMMC CMCP UFS Planting Tin Platform with 0.15mm BGA169 BGA153 reballing stencil.
9. DIYPHONE EMMC:3 BGA reballing stencil 0.15mm steel mesh: for EMMC/EMCP/UFS/UMCP/LPDDR/NAND/PCIE, supports BGA221, BGA169, BGA153, BGA162, BGA178, BGA254, BGA297, BGA315, BGA200, BGA110, BGA70, BGA60.
Features:
1. Brand New.
2. BGA stencil for reballing pins for BGA Stencil Car PC Board Controller IC Reballing Pins Solder Tin Plant Net Amaoe Square Hole Heating Steel Mesh
Advantage:
1. Deformation resistant material
2. Precise pins locatio
3. Square round hole
4. Good material
